Stmicroelectronics launches high-performance MEMS inertial modules aimed at demanding AR, VR and tracking applications

Stmicroelectronics launches high-performance MEMS inertial modules aimed at demanding AR, VR and tracking applications

tenco 2019-06-21

Aimed at the next generation of performance-focused gaming, industrial and sports applications, stmicroelectronics has launched the LSM6DSR inertia module, which combines high stability, advanced digital functions, low power consumption and small size for head-mounted displays, wearable trackers, smartphones, robots and uavs.


The LSM6DSR MEMS system-level package includes a 3-axis digital accelerometer and a 3-axis digital gyroscope, and the angular rate range is specifically expanded to 4,000 degrees per second for measuring fast-moving gaming and motion applications.It meets the requirements of mainstream mobile operating system, supports S4S sensor synchronization technology, LSM6DSR is compatible with mainstream mobile platform, and has physical sensing, virtual sensing and batch sensing functions. It integrates 9KB FIFO memory on chip (with compression function), and supports dynamic batch processing of sensor data.

The LSM6DSR powers games and professional applications to create a more immersive virtual reality (VR) experience, as well as superior augmented reality (AR) functionality on new smartphones.In addition, the module's native advanced pedometer, step detector and counter, as well as effective motion detection and tilt detection, ensure accurate and efficient activity identification.In addition, the LSM6DSR is ideal for sensor hubs and Internet of things devices, indoor navigation and uav camera optical anti-vibration system (OIS).

The enhanced mechanical design ensures exceptional stability of the module, minimizing sensor deviations, offsets and drifters, and temperature related parameters.The excellent stability ensures that the sensor performance remains unchanged for a long time, and saves the host system from running complex re-tuning procedures, thus reducing the power consumption of the system and maximizing the application performance.

The LSM6DSR is now in production and is packaged in 2.5mm x 3mm x 0.83mm 14 pin LGA plastic.

Tenco Technology