Pads, Sheets are in stock at Tenco Electronics. In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are a pre-formed square or rectangle of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).Tenco offers inventory, pricing, & datasheets for Pads, Sheets. To know more, please view our large section of Pads, Sheets below.
| Bild | Teilenummer | Hersteller | Beschreiben | Anzahl | Bezugspreis($) | |
|---|---|---|---|---|---|---|
|
AF200-301205 | CUI Inc. |
THERMAL INTERFACE MATERIAL, AF20
|
|
|
1+$
0.06
10+$
0.06
100+$
0.06
500+$
0.06
1000+$
0.06
|
|
|
AF200-313005 | CUI Inc. |
THERMAL INTERFACE MATERIAL, AF20
|
|
|
1+$
0.15
10+$
0.15
100+$
0.14
500+$
0.14
1000+$
0.14
|
|
|
AF200-414505 | CUI Inc. |
THERMAL INTERFACE MATERIAL, AF20
|
|
|
1+$
0.30
10+$
0.29
100+$
0.29
500+$
0.28
1000+$
0.28
|
|
|
AF200-505005 | CUI Inc. |
THERMAL INTERFACE MATERIAL, AF20
|
|
|
1+$
0.39
10+$
0.38
100+$
0.37
500+$
0.37
1000+$
0.36
|
|
|
AF200-707005 | CUI Inc. |
THERMAL INTERFACE MATERIAL, AF20
|
|
|
1+$
0.79
10+$
0.77
100+$
0.76
500+$
0.74
1000+$
0.73
|
|
|
AF500-301205 | CUI Inc. |
THERMAL INTERFACE MATERIAL, AF50
|
|
|
1+$
0.14
10+$
0.14
100+$
0.13
500+$
0.13
1000+$
0.13
|
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