374124B00035G

374124B00035G

$4.92


Beschreiben :
HEATSINK BGA W/ADHESIVE TAPE
Anzahl :
40291

Echtzeitverfügbarkeit

Stock: 40291 Versenden kann

1+: $ 4.92
10+: $ 4.82
100+: $ 4.73
500+: $ 4.63
1000+: $ 4.54
ManufacturerAavid, Thermal Division of Boyd Corporation
Series-
Part StatusActive
TypeTop Mount
Package CooledBGA
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Pin Fins
Length0.906" (23.01mm)
Width0.906" (23.01mm)
Diameter-
Height Off Base (Height of Fin)0.709" (18.00mm)
Power Dissipation @ Temperature Rise2.0W @ 50°C
Thermal Resistance @ Forced Air Flow7.40°C/W @ 200 LFM
Thermal Resistance @ Natural23.40°C/W
MaterialAluminum
Material FinishBlack Anodized

New and Original electronic components 374124B00035G from Aavid, Thermal Division of Boyd Corporation Huge inventory, fast shipment, Tenco electronics website accept order online、BOM list quotation, and accept various payment term. Right now register as our member,you can get lots of discounts. For any inquiry, welcome to send email to us, or leave a message.

Electronic components customers

Tenco Technology Co.,Ltd, is a global electronic components distributor. Our company distribute many famous brands like Maxim、Linear、ADI、XILINX、Altera、Microchip、ST、TI、Cypress、Samsung etc...meanwhile we expert to provide Obsoleted、 ic chips. Based on our high quality products, best service, we win the trusts from customes all over the world. Now Tenco have sufficient stock items, Tenco has maintained a multi-faceted cooperation of stability, trust, mutual support and win-win business with many high-tech manufacturers, scientific research institutions and domestic and foreign trading company.
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